Main menu


New Books [LastPost]

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging by Xing-Chang Wei

 Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging by Xing-Chang Wei

Contents of Modeling and Design of Electromagnetic Compatibility

1 Electromagnetic Compatibility for High-Speed Circuits
2 Modal Field of Power–Ground Planes and Grids
3 Integral Equation Solutions
4 Extraction of Via Parameters
5 Printed Circuit Board-Level Electromagnetic Compatibility Design
6 Interposer Electromagnetic Compatibility Design
7 New Structures and Materials

Preface of Modeling and Design of Electromagnetic Compatibility

A high-speed circuit is the base of contemporary information and communication technology (ICT) and consumer electronics. Our modern life is heavily dependent on the functioning of high-speed circuits developed for various purposes. Therefore, the electromagnetic compatibility (EMC) among various circuits becomes very important. Because of ever-increasing clock frequencies and their harmonics, the electromagnetic field spectrum on the printed circuit board (PCB) and inside the electronic package extends to several tens of gigahertz. 

With decreased wavelengths, the electromagnetic wave phenomenon on the PCB and inside the package is obvious. This makes the signal spread over the entire PCB and package instead of confirming along the traces. At the same time, the three-dimensional integration including the through silicon via (TSV) based system-in-package (SiP) greatly increases the circuit density and complexity. Such a high frequency and a high density become a big challenge for the EMC control of high-speed circuits. 

This book presents EMC modeling and control methods based on the author’s many years’ of research. The emphasis of this book is placed on two essential passive components of a high-speed circuit: the power distribution network and the signal distribution network. The field-circuit hybrid modeling and simulation methods of these passive components are discussed in detail. In addition, this book also explores the applications of novel structures and materials, including highimpedance surfaces and graphene films, in the EMC design, where the traditional bulk EMC materials cannot be used. 

The signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI) are three major EMC issues related to a high-speed circuit. For each of them, there are lots of EMC problems. Because of this diversity, the EMC is always analyzed and designed on a case-by-case basis. An EMC beginner usually finds it difficult to know where to start. 

However, behind all EMC problems is the behavior of the electromagnetic field in different environments. The study of the electromagnetic field characteristics is the key to better understand EMC problems and their control methods. The electromagnetic modeling is very important and is the best way to accurately get an insight into the electromagnetic phenomena. From that insight, some general theories can be obtained from disordered EMC phenomena. With the advancement of the computing technology, EMC design has changed from the cut and try to the engineering art in recent years. Most of the potential EMC problems can be predicted with a remarkable accuracy through electromagnetic simulation. This book therefore provides a detailed description of the electromagnetic modeling of the EMC problems. The author hopes that this book will serve a basis for further progress in the high-speed circuit EMC for both academic research and industrial applications.

Download This Book For Free In PDF Format



1 comment
Post a Comment
  1. This book is well written I really need it badly. Can I have access to download it please?


Post a Comment

table of contents title